QPT just filed a patent for the “qAttach” process, a novel way to attach dies to heat spreaders or substrates (typically aluminum nitride (AlN)) that significantly reduces thermal resistance. The new ...

Die attach materials form the cornerstone of reliable power electronic packaging, providing the essential bond between semiconductor devices and their substrates. Recent advances have focused on ...

High-power semiconductor applications currently represent one of the highest growth sectors of any semiconductor technology, specifically because many of the key applications are driven by the ...

The power electronics industry is facing a problem in that, as the power handled by transistors increases to meet the needs of new applications, the packaging will increasingly struggle to remove the ...

Today’s fan-out wafer-level packaging (FOWLP) processes use organic substrates composed of epoxy mold compound (EMC) created using a thermal compression process. EMC wafers are a cost-effective way to ...

Dublin, April 19, 2024 (GLOBE NEWSWIRE) -- The "Die-Attach Materials - Global Strategic Business Report" report has been added to ResearchAndMarkets.com's offering. Global Die-Attach Materials Market ...

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Shibuya-ku, Tokyo, Japan, Japan, Jul 14, 2022, 07:23 /Comserve / -- Die Attach Equipment Market size, share, growth, trends, segmentation, top key players, strategies ...

Today more than ever, cost reductions are being driven away from the traditional materials and bill of materials (BOM) reductions and into reductions in labor and manufacturing costs associated with ...

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